SM30T18AY Datasheet, PDF (5/13 Pages) STMicroelectronics – Automotive 3000 W Transil™

SM30TY
Characteristics
Figure 9.
100.0 ^IFM(A)
Peak forward voltage drop versus
peak forward current
(typical values)
Figure 10. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration
1.00 ^{Zth(j-a)/Rth(j-a)}
Recommended pad layout
10.0
1.0
T_j = 150 °C
T_j = 25 °C
0.10
Single pulse
epoxy printed board, FR4 copper thickness = 35 µm
0.1
V_FM(V)
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
0.01
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
t_p(s)
1.E+02 1.E+03
Figure 11.
Thermal resistance junction to ambient versus copper surface under each lead
100 ^{Rth(j-a)(°C/W)}
epoxy printed board, FR4 copper thickness = 35 µm
90
80
70
60
50
40
30
20
10
0
S_Cu(cm²)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Doc ID 022065 Rev 2
5/13