ESDAVLC6-1V2 Datasheet, PDF (5/8 Pages) STMicroelectronics – Single line low capacitance Transil™ for ESD protection

ESDAVLC6-1V2
Recommendation on PCB assembly
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Recommendation on PCB assembly
3.1
Stencil opening design
Stencil opening thickness: 80 µm
Figure 8. Recommended stencil window position
K
M
N
L
K = 180 µm L = 180 µm M = 150 µm N = 30 µm
Solder pad
PCB opening
Stencil aperture (thickness stencil: 80 µm)
3.2
Solder paste
1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste recommended.
3. Offers a high tack force to resist component displacement during PCB movement.
4. Solder paste with fine particles: type 4 (powder particle size 20-38 µm per IPC J-STD-
005).
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