EMIF06-MSD01F2 Datasheet, PDF (5/7 Pages) STMicroelectronics – IPAD™ Mini and micro SD Card - EMI filtering and 25 kV ESD protection

EMIF06-mSD01F2
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Ordering information scheme
Ordering information scheme
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip-Chip
x = 2: Lead free Pitch = 500 µm, Bump = 315 µm
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Package information
Figure 9.
Flip-Chip Package dimensions
500 µm ± 50
315 µm ± 50
650 µm ± 65
1.92 mm ± 50 µm
Figure 10. Foot print recommendations Figure 11. Marking
Copper pad Diameter:
250 µm recommended , 300 µm max
Solder stencil opening: 330 µm
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
E
xxz
y _ww
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