EMIF03-SIM04F3 Datasheet, PDF (5/7 Pages) STMicroelectronics – 3-line IPAD™, EMI filter including ESD protection

EMIF03-SIM04F3
3
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
Figure 10. Package dimensions
255 µm ± 40
400 µm ± 30
605 µm ± 55
170 µm
Figure 11. Footprint
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
1.54 mm ± 30 µm
Figure 12. Marking
Dot, ST logo
ECOPACK® Grade
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
xxz
y _ww
Figure 13. Flip-Chip tape and reel specification
Dot identifying pin A1 location 2.0 ± 0.05
4.0 ± 0.1
Ø 1.5 ± 0.1
0.69 ± 0.05
All dimensions in mm
1.31
4.0 ± 0.1
User direction of unreeling
Doc ID 17053 Rev 2
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