CD00001366 Datasheet, PDF (5/10 Pages) STMicroelectronics – Transil

SMBJ
Characteristics
Figure 6.
C(pF)
10000
1000
100
10
1
Junction capacitance versus
Figure 7.
reverse applied voltage for
unidirectional types (typical values)
F=1 MHz
V_osc=30 mV_RMS
T_j=25 °C
C(pF)
10000
SMBJ5.0A
1000
SMBJ12A
SMBJ24A
SMBJ40A
100
SMBJ85A
V_R(V)
10
SMBJ188A
100
1000
10
1
Junction capacitance versus
reverse applied voltage for
bidirectional types (typical values)
SMBJ5.0CA
F=1 MHz
V_osc=30 mV_RMS
T_j=25 °C
SMBJ12CA
SMBJ24CA
SMBJ40CA
SMBJ85CA
V_R(V)
10
SMBJ188CA
100
1000
Figure 8. Peak forward voltage drop
versus peak forward current
(typical values)
I_FM(A)
1.0E+02
1.0E+01
1.0E+00
T_j =125 °C
T_j =25 °C
Figure 9. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration
Z_th(j-a) / R_th(j-a)
1.00
Recommended pad layout
PCB FR4, copper thickness = 35 µm
0.10
1.0E-01
1.0E-02
V_FM(V)
0.01
t_P(s)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
Figure 10. Thermal resistance, junction to
ambient, versus copper surface
under each lead
110 ^{Rth(J-A)(°C/W)}
100
PCB FR4, copper thickness = 35 µm
90
80
70
60
50
40
30
20
10
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 11. Leakage current versus junction
temperature (typical values)
1.E+03 ^{IR (nA)}
1.E+02
V_R=V_RM
V_RM < 10 V
1.E+01
1.E+00
1.E-01
25
V_R=V_RM
V_RM ≥ 10 V
T_j(°C)
50
75
100
125
150
Doc ID 5616 Rev 10
5/10