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AN2842 Datasheet, PDF (5/22 Pages) STMicroelectronics – Paralleling of power MOSFETs in PFC topology
AN2842
2
Approach to the study
Approach to the study
To better understand the factors that cause current imbalance, it is important to divide the
analysis into two different areas: in the first, we study the influence of the parameters around
the power device, while in the second we analyze the impact of the intrinsic parameters of
the power MOSFET. The parameters analyzed in the first approach are:
● differences between the power circuit components
● gate circuitry
● influence of the boost diode in the current imbalance
● temperature imbalance between devices
In the second part, we analyze the parameters linked directly to the power MOSFET, and in
particular:
● differences in the VGS(th)
● differences of RDS(on)
● influence of the gfs parameter
2.1
Differences between the power circuit components
The primary contributors to current imbalance in power circuits are different drain or branch
inductance and common source inductance. These "parasitic" inductances (labeled as Lp in
Figure 4) are mainly generated by interconnection wiring and discrete components and
have different effects depending on where they are situated. Thus the variation between
branches is a function of layout symmetry and production tolerance. If we analyze a system
that uses devices with similar electrical characteristics, the different device behaviors are
linked to external parameters.
Figure 4. Parasitic inductance in a circuit
!-V
The impact due to the inductance in series to the gate terminal during the turn-on operation
is a delay of the event. In fact, when the signal coming to the driver is applied to the gate, the
inductance Lp in series generates an extra voltage that decreases the real voltage on the
gate pin and consequently causes a delay of the operation. The same delay effects during
turn-on are caused by the parasitic inductances on the drain and source pins. Also during
turn-off operation, the impact due to the parasitic inductances is to generate a delay of the
commutations. In the following figure, we can see how an external inductance introduced on
the gate pin generates a delay on the drain current.
Doc ID 15110 Rev 1
5/22