STTS2002_11 Datasheet, PDF (47/52 Pages) STMicroelectronics – 2.3 V memory module temperature sensor with a 2 Kb SPD EEPROM

STTS2002
Package mechanical data
Table 32 lists variations of landing pattern implementations, ranked as “Preferred” and
Minimum Acceptable” based on the JEDEC proposal.
Table 32. Parameters for landing pattern - TDFN8 package (DN)
Parameter
Description
D2
Heat paddle width
E2
Heat paddle height
E3
Heat paddle centerline to contact inner locus
L
Contact length
K
Heat paddle to contact keepout
K2
Contact to contact keepout
e
Contact centerline to contact centerline pitch for inner contacts
b
Contact width for inner contacts
e2
Landing pattern centerline to outer contact centerline, “minimum
acceptable” option⁽¹⁾
b2
Corner contact width, “minimum acceptable option”⁽¹⁾
e4
Landing pattern centerline to outer contact centerline, “preferred”
option⁽²⁾
b4
Corner contact width, “preferred” option⁽²⁾
1. Minimum acceptable option to be used when routing prevents preferred width contact.
2. Preferred option to be used when possible.
Dimension
Min
Nom
Max
1.40
-
1.60
1.40
-
1.60
1.00
-
-
0.70
-
0.80
0.20
-
-
0.20
-
-
-
0.50
-
0.25
-
0.30
-
0.50
-
0.25
-
0.30
-
0.60
-
0.45
-
0.50
Doc ID 15389 Rev 5
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