VN7140AJ Datasheet, PDF (41/55 Pages) STMicroelectronics – High-side driver with MultiSense analog feedback for automotive applications

VN7140AJ, VN7140AS
6.2
SO-8 thermal data
Package and PCB thermal data
Figure 48: S0-8 on two-layers PCB (2s0p to JEDEC JESD 51-5)
Figure 49: SO-8 on four-layers PCB (2s2p to JEDEC JESD 51-7)
Table 16: PCB properties
Dimension
Value
Board finish thickness
1.6 mm +/- 10%
Board dimension
77 mm x 86 mm
Board Material
FR4
Copper thickness (top and bottom layers)
0.070 mm
Copper thickness (inner layers)
0.035 mm
Thermal vias separation
1.2 mm
Thermal via diameter
0.3 mm +/- 0.08 mm
Copper thickness on vias
0.025 mm
Heatsink copper area dimension (bottom layer)
Footprint, 2 + 2 cm² or 8 + 8 cm²
DocID027401 Rev 3
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