TN1215-G Datasheet, PDF (4/5 Pages) STMicroelectronics – SCR

TN1215-G
Fig. 7: Non repetitive surge peak on-state current
for a sinusoidal pulse with width tp<10ms, and cor-
responding value of I²t.
Fig. 8: On-state characteristics(maximum values).
ITSM(A),I t(A s)
500
100
ITSM
It
tp(ms)
10
1
2
Tj initial=25°C
ITM(A)
100.0
Tj=Tj max.
10.0
1.0
Tj=25°C
Tj max.:
Vto=0.77V
Rt=30mΩ
VTM(V)
0.1
5
10
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Fig. 9: Thermal resistance junction to ambient ver-
sus copper surface under tab (Epoxyprinted circuit
board FR4, copper thickness: 35µm).
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
S(Cu) (cm )
0
0 4 8 12 16 20 24 28 32 36 40
Fig. 10: Typical reflow soldering heat profile, either
for mounting on FR4 or metal-backed boards.
T (°C)
250
200
245°C
215°C
150
Epoxy FR4
board
100
50
0
0
Metal-backed
board
t (s)
40 80 120 160 200 240 280 320 360
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