TN0985 Datasheet, PDF (4/32 Pages) STMicroelectronics – Class S equivalent” for CMOS4000B and 54HCMOS series

Procedure
2
Procedure
TN0985
The “Class S equivalent” qualification and manufacturing flow proposed by
STMicroelectronics is based on the ESCC 9000 assembly, test, and quality conformance
inspection (QCI) flows. Specific additional tests were performed to align the ESCC flow to
the Class S requirements. The reference document, TOR-2006(8583)-5236 Revision A,
Appendix C, provides details on the “Alternate QCI Test and Sampling Plan”.
Table 1 through to Table 4 present the “Class S equivalent” flow in the far right columns.
Table 1 shows the “screening test comparison”: “Class S” and “ESCC 9000 flow chart F3”.
Table 2, Table 3, and Table 4 show the “QCI comparison”: “Group A/B/D tests for Class S”
and “ESCC 9000”.
Figure 1 describes all the steps of the “Class S equivalent” screening flow.
Figure 2 describes the QCI flow which was applied with reference to the ESCC 9000 QCI
(chart F4 subgroup 1, 2, and 3) and additional tests.
2.1
Screening flow
Table 1. Comparison between Class S, ESCC 9000 flow chart F3, and ST “Class S equivalent”
flow
Screen
Screening test comparison
Class S
ESCC 9000 flow chart F3
ST “Class S equivalent” flow
Wafer lot
acceptance
883 TM5007
Process monitoring review according to ST SPC⁽¹⁾ rules + SEM⁽²⁾ per
ESCC 21400 + total dose radiation testing (if applicable) ESCC 22900
Non
destructive
bond pull
883 TM2023
In process destructive test under SPC control 883 TM2011
Internal visual 883 TM2010 cond. A
ESCC 20400 and 2049000
883 TM2010 cond. A 100 %
Stabilization
bake
883 TM1008, 24 hours at maximum storage temperature rating.
Temperature
cycling
883 TM1010 cond. C
Constant
acceleration
Visual
inspection
PIND⁽³⁾
883 TM2001 cond. E
Not performed
883 TM2020 cond. A
883 TM2001 cond. E
As per 883 TM2001 cond. E
Serialization
Required
Pre burn-in
electrical
measurements
Per applicable
SMD⁽⁴⁾
Per applicable ESCC detailed
specification
Per applicable ESCC detailed
specification⁽⁵⁾
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