SM6HTXXA Datasheet, PDF (4/5 Pages) STMicroelectronics – HIGH TEMPERATURE TRANSILTM FOR AUTOMOTIVE APPLICATIONS

SM6HTxxA
Fig. 6: Variation of thermal impedance junction to
ambient versus pulse duration (Printed circuit
board FR4 with recommended pad layout).
Zth(j-a)(°C/W)
1E+2
1E+1
1E+0
1E-1
1E-3
1E-2
tp(s)
1E-1 1E+0
1E+1
1E+2 5E+2
Fig. 7: Thermal resistance junction to ambient ver-
sus copper surface under each lead (printed circuit
board FR4, e(Cu)=35µm).
Rth(j-a) (°C/W)
100
90
80
70
60
50
S(cm²)
40
0
1
2
3
4
5
Fig .8: Variation of leakage current versus junction
temperature (typical values).
IR(µA)
1E+4
1E+3
1E+2
1E+1
1E+0
1E-1
1E-2
1E-3
1E-4
25 50
Tj(°C)
75 100 125 150 175
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