SM6HT Datasheet, PDF (4/6 Pages) STMicroelectronics – HIGH TEMPERATURE TRANSIL FOR AUTOMOTIVE APPLICATIONS

SM6HT
Figure 7: Variation of thermal impedance
junction to ambient versus pulse duration
(Printed circuit board FR4 with recommended
pad layout)
Zth(j-a)(°C/W)
1E+2
1E+1
1E+0
1E-1
1E-3
1E-2
tp(ms)
1E-1
1E+0
1E+1
1E+2 5E+2
Figure 8: Thermal resistance junction to
ambient versus copper surface under each
lead (printed circuit board FR4, e(Cu)=35µm)
Rth(j-a)(°C/W)
100
90
80
70
60
50
S(cm²)
40
0
1
2
3
4
5
Figure 9: Variation of leakage current versus
junction temperature (typical values)
IR(µA)
2E+0
1E+0
1E-1
Tj(°C)
4E-2
25
50
75
100
125
150
175
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