P0109AL-5AA4 Datasheet, PDF (4/11 Pages) STMicroelectronics – Sensitive standard SCRs up to 0.8 A

Characteristics
P010xx
Table 6. Thermal resistance
Symbol
Parameter
Maximum
R_th(j-a) Junction to case (DC)
R_th(j-t) Junction to tab (DC)
R_th(j-a) Junction to ambient (DC)
TO-92
80
SOT-223
30
TO-92
150
S⁽¹⁾ = 5 cm² SOT-223
60
R_th(j-a) Junction to ambient (mounted on FR4 with recommended pad layout) SOT23-3L
400
1. S = Copper surface under tab.
Unit
°C/W
°C/W
°C/W
°C/W
Figure 1.
Maximum average power
dissipation vs. average on-state
current P010xxA and P010xxN
Figure 2.
Maximum average power
dissipation vs. average on-state
current P010xxL
P(W)
1.0
0.9
α = 180°
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.0
0.1
IT(AV)(A)
0.2
0.3
0.4
360°
α
0.5
0.6
P(W)
0.30
0.28
α = 180°
0.26
0.24
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.08
360°
0.06
0.04
0.02
IT(AV)(A)
α
0.00
0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18
Figure 3.
Average and DC on-state current
vs. lead temperature
P010xxA and P010xxN
Figure 4.
Average and DC on-state current
vs. ambient temperature P010xxA
and P010xxN
IT(AV)(A)
1.1
1.0
D.C. (SOT-223)
0.9
0.8
D.C. (TO-92)
0.7
0.6
α = 180° (SOT-223)
0.5
0.4
0.3
α = 180° (TO-92)
0.2
0.1
Tlead(°C)
0.0
0
25
50
75
100
125
IT(AV)(A)
1.2
1.1
D.C. (SOT-223)
1.0
0.9
0.8
0.7
D.C. (TO-92)
0.6
0.5
α = 180° (SOT-223)
0.4
0.3
α = 180° (TO-92)
0.2
0.1
Tamb(°C)
0.0
0
25
50
75
Device mounted on
FR4 with recomended
pad layout for SOT-223
100
125
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