EMIF06-VID01C1 Datasheet, PDF (4/6 Pages) STMicroelectronics – 6 LINES LOW CAPACITANCE EMI FILTER AND ESD PROTECTION

EMIF06-VID01C1
Figure 8: Ordering Information Scheme
EMIF yy - xxx zz Cx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
C = Coated Flip-Chip
x = 1: 500µm, Bump = 315µm
= 2: Leadfree Pitch = 500µm, Bump = 315µm
Figure 9: FLIP-CHIP Package Mechanical Data
500µm ± 50
250µm ± 50
315µm ± 50
690µm ± 65
2.92mm ± 50µm
Figure 10: Foot Print Recommendations
Figure 11: Marking
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 300µm copper pad diameter
Dot, ST logo
365
240
xx = marking
z = packaging location
yww = date code
(y = year
ww = week)
xxz
y _ww
All dimensions in µm
4/6