BAT46_06 Datasheet, PDF (4/11 Pages) STMicroelectronics – Small signal Schottky diodes

Characteristics
BAT46 Series
Figure 7.
Forward voltage drop versus
forward current (typical values,
high-level)
I_FM(A)
1.E+00
1.E-01
Tj=125 °C
Tj=25 °C
Figure 8.
Relative variation of thermal
impedance junction to ambient
versus pulse duration - printed
circuit board, epoxy FR4
e_CU = 35 µm (SOD-323)
Z_th(j-a) /R_th(j-a)
1.00
Single pulse
SOD-323
0.10
1.E-02
VFM(V)
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
0.01
1.E-02
1.E-01
tP(s)
1.E+00
Epoxy FR4
S_CU=2.25 mm²
e_CU=35 µm
1.E+01
1.E+02
Figure 9.
Relative variation of thermal
impedance junction to ambient
versus pulse duration -
aluminium oxide substrate
10 mm x 8 mm x 0.5 mm (SOT-23)
Z_th(j-a) /R_th(j-a)
1.00
Single pulse
SOT-23
Figure 10.
Variation of thermal impedance
junction to ambient versus pulse
duration - printed circuit board,
epoxy FR4, e_CU = 35 µm (SOT-323)
Z_th(j-a) (°C/W)
1000
Single pulse
SOT-323
0.10
0.01
1.E-02
1.E-01
tP(s)
1.E+00
Alumine substrate
10 x 8 x 0.5 mm
1.E+01
1.E+02
Figure 11.
Thermal resistance junction to
ambient versus copper surface
under each lead, epoxy FR4,
e_CU = 35 µm (SOD-323)
R_th(j-a) (°C/W)
600
550
500
450
400
350
300
0
SCU(mm²)
5 10 15 20 25 30 35 40 45 50
100
10
1.E-02
1.E-01
tP(s)
1.E+00
1.E+01
1.E+02
4/11