TDA7590 Datasheet, PDF (38/40 Pages) STMicroelectronics – Digital signal processing IC for speech and audio applications

Package information
9 Package information
TDA7590
In order to meet environmental requirements, ST offers these devices in ECOPACK^®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 3. TQFP144 Mechanical data & package dimensions
mm
inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A
1.20
0.047
A1 0.05
0.15 0.002
0.006
A2 0.95 1.00 1.05 0.037 0.039 0.041
B 0.17 0.22 0.27 0.007 0.009 0.011
C 0.09
0.20 0.003
0.008
D 21.80 22.00 22.20 0.858 0.866 0.874
D1 19.80 20.00 20.20 0.779 0.787 0.795
D2 2.00
0.079
D3
17.50
0.689
e
0.50
0.020
E 21.80 22.00 22.20 0.858 0.866 0.874
E1 19.80 20.00 20.20 0.779 0.787 0.795
E2 2.00
0.079
E3
17.50
0.689
L 0.45 0.60 0.75 0.018 0.024 0.030
L1
1.00
0.0393
K
3.5˚ (min.), 7˚(max.)
ccc
0.08
0.03
Note 1: Exact shape of each corner is optional.
OUTLINE AND
MECHANICAL DATA
TQFP144
(20x20x1.0mm exposed Pad Down)
38/40
7386636