A22H165 Datasheet, PDF (33/36 Pages) STMicroelectronics – High-performance class-G stereo headphone amplifier

A22H165
5
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
Figure 73. A22H165 footprint recommendation
PCB pad size: Φ = 260 µm maximum
Φ = 220 µm recommended
400 μm
400 μm
75 µm min.
100 μm max.
Track
Not soldered
mask opening
150 μm min.
Solder mask opening: Φ = 300 μm min
(for 260 µm diameter pad)
TOP VIEW
Pad in Cu 18 μm with Flash NiAu (2-6 μm, 0.2 μm max.)
Figure 74. Pinout
BOTTOM VIEW
INR- VOUTR
GAIN
EN
D
D EN
GAIN VOUTR INR-
INR+
CMS
PVSS
C2 C
C C2
PVSS
CMS
INR+
INL+ HPVDD
C1
AGND _B
B ^AGND
C1
HPVDD INL+
INL-
VOUTL AVDD
4
3
2
SW _A
1
A ^SW
1
AVDD VOUTL
INL-
2
3
4
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