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| STWBC Datasheet, PDF (32/36 Pages) STMicroelectronics – Digital controller for wireless battery charger | |||
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Thermal characteristics
6
Thermal characteristics
STWBC
The STWBC functionality cannot be guaranteed when the device operating exceeds the
maximum chip junction temperature (TJmax).
TJmax, in °C, may be calculated using equation:
TJmax = TAmax + (PDmax x ïJA)
where:
TAmax is the maximum ambient temperature in °C
ïJA is the package junction to ambient thermal resistance in °C/W
PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)
PINTmax is the product of IDD and VDD, expressed in watts. This is the maximum chip internal
power.
PI/Omax represents the maximum power dissipation on output pins where:
PI/Omax = ï (VOL * IOL) + ïï [(VDD - VOH) * IOH],
taking into account the actual VOL/IOL and VOH/IOH of the I/Os at the low and high level.
Table 20. Package thermal characteristics
Symbol
Parameter
Value
Unit
ïJA VFQFPN32 - thermal resistance junction to ambient(1)
26
°C/W
1. Thermal resistance is based on JEDEC JESD51-2 with 4-layer PCB in a natural convection environment.
32/36
DocID027322 Rev 3
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