M29DW323DT Datasheet, PDF (32/49 Pages) STMicroelectronics – 32 Mbit 4Mb x8 or 2Mb x16, Dual Bank 8:24, Boot Block 3V Supply Flash Memory

M29DW323DT, M29DW323DB
PART NUMBERING
Table 20. Ordering Information Scheme
Example:
M29DW323DB 70 N 1 T
Device Type
M29
Architecture
D = Dual Bank
Operating Voltage
W = V_CC = 2.7 to 3.6V
Device Function
323D = 32 Mbit (x8/x16), Boot Block, 1/4-3/4 partitioning
Array Matrix
T = Top Boot
B = Bottom Boot
Speed
70 = 70 ns
90 = 90 ns
Package
N = TSOP48: 12 x 20 mm
ZA = TFBGA63: 7 x 11mm, 0.80 mm pitch
ZE = TFBGA48: 6 x 8mm, 0.8mm pitch
Temperature Range
1 = 0 to 70 °C
6 = –40 to 85 °C
Option
Blank = Standard Packing
T = Tape & Reel Packing
E = Lead-free Package, Standard Packing
F = Lead-free Package, Tape & Reel Packing
Note: This product is also available with the Extended Block factory locked. For further details and ordering
information contact your nearest ST sales office.
Devices are shipped from the factory with the memory content bits erased to ’1’.
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this de-
vice, please contact the ST Sales Office nearest to you.
32/49