M24C16-DRE Datasheet, PDF (32/39 Pages) STMicroelectronics – 16-Kbit serial IC bus EEPROM - 105C operation

Package mechanical data
9
Package mechanical data
M24C16-DRE
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
Figure 12. TSSOP8 – 8-lead thin shrink small outline, package outline

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1. Drawing is not to scale.
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Table 13. TSSOP8 – 8-lead thin shrink small outline, package mechanical data
Symbol
millimeters
Typ.
Min.
Max.
Typ.
inches⁽¹⁾
Min.
Max.
A
-
-
1.200
-
-
0.0472
A1
-
0.050
0.150
-
0.0020
0.0059
A2
1.000
0.800
1.050
0.0394
0.0315
0.0413
b
-
0.190
0.300
-
0.0075
0.0118
c
-
0.090
0.200
-
0.0035
0.0079
CP
-
0.100
-
-
0.0039
D
3.000
2.900
3.100
0.1181
0.1142
0.1220
e
0.650
-
-
0.0256
-
-
E
6.400
6.200
6.600
0.2520
0.2441
0.2598
E1
4.400
4.300
4.500
0.1732
0.1693
0.1772
L
0.600
0.450
0.750
0.0236
0.0177
0.0295
L1
1.000
-
-
0.0394
-
-
α
-
0°
8°
-
0°
8°
1. Values in inches are converted from mm and rounded to four decimal digits.
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