STCD2400F35F Datasheet, PDF (31/39 Pages) STMicroelectronics – Multichannel clock distribution circuit

STCD22x0, STCD23x0, STCD24x0
8
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
Figure 25. Flip Chip 12-bump, package mechanical outline
Doc ID 15400 Rev 2
7504892_L(E)
31/39