TN1198 Datasheet, PDF (3/10 Pages) STMicroelectronics – Surface mount guidelines for MEMS sensors in HLGA packages

TN1198
General guidelines for soldering surface-mount
MEMS sensors
1
General guidelines for soldering surface-mount
MEMS sensors
The following three elements must be considered in order to adhere to standard PCB
design and good industrial practices when soldering MEMS sensors:
• PCB design should be as symmetrical as possible:
− large traces on V_DD / GND lines are not required (very low power consumption)
− no vias or traces below the sensor footprint
• Solder paste must be as thick as possible (after soldering) in order to:
− reduce the decoupling stress from the PCB to the sensor
− avoid that the PCB solder mask touches the device package
• Solder paste thickness must be as uniform as possible (after soldering) to avoid
uneven stress:
− Final volume of soldering paste within 20% among lands is possible using the
SPI (Solder Paste Inspection) control technique
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