TDA7267A Datasheet, PDF (3/7 Pages) STMicroelectronics – 3W MONO AMPLIFIER

THERMAL DATA
Symbol
R_{th j-amb}
R_{th j-case}
Parameter
Thermal Resistance Junction to ambient
Thermal Resistance Junction to case
TDA7267A
Value
70
15
Unit
°C/W
°C/W
ELECTRICAL CHARACTERISTICS (T_amb = 25°C; V_S = 14.5V; R_L = 8Ω; f = 1KHz; unless otherwise
specified.)
Symbol
V_S
I_S
I_sb
V_O
AV
R_IN
P_O
THD
SVR
Parameter
Supply Voltage Range
Quiescent Current
Stand-By Current
Quiescent Output Voltage
Voltage Gain
Input Impedance
Output Power
Distortion
Supply Voltage Rejection
E_I
Input Noise Voltage
Vsb
Stand-By Enable Voltage
Test Condition
Min.
5
Pin 3 shorted to GND
31
50
THD = 10%
2.7
PO = 1W
V_ripple = 150mVrms;
F_ripple = 1KHz
Rg = 10KΩ; BW = 20Hz to 20KHz
Typ.
23
7.5
100
3
0.1
50
5
Max.
18
35
0.3
33
0.3
10
1
Unit
V
mA
mA
V
dB
KΩ
W
%
dB
µV
V
Figure 1. Application Circuit
IN
STAND-BY
C1 0.1µF
IN 4
SVR
3
C3
47µF
V_S
1
6
2
9 to 16
C4
100µF
C5 470µF
OUT
8Ω
S-GND
P-GND
D98AU828
V_S=14.5V
APPLICATION HINTS:
For 14.5V supply and 8Ω speaker application, its
maximum power dissipation is about 1.8W.
Assumming that max ambient temperature is
70°C, the required thermal resistance of the de-
vice mounted on the PCB with a dissipating area
must be equal to: (150 - 70)/1.8 = 44.4°C/W.
Junction to pin thermal resistance of the package
is about 15°C/W. That means external heat sink
of about 30°C/W is required.
Cu ground plane of PCB can be used as heat dis-
sipating means.
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