SM2T Datasheet, PDF (3/5 Pages) STMicroelectronics – Transient Voltage Suppressor: TRANSIL ™

SM2T series
Fig. 3: Average power dissipation versus ambient tem-
perature.
P(W)
3.0
2.5
Tamb = Ttab
2.0
1.5
1.0
0.5
0.0
0
Printed circuit board FR4,
recommended pad layout
Tamb(°C)
25
50
75
100
125
150
Fig. 4: Variation of thermal impedance junction to ambient
versus pulse duration.
Zth(j-a)(°C/W)
1000.0
100.0
10.0
S=0.135cm²
S=2cm²
1.0
0.1
1.E-03
1.E-02
1.E-01
tP(s)
1.E+00 1.E+01 1.E+02 1.E+03
Fig. 5: Thermal resistance junction to ambient versus
copper surface under tab.
Rth(j-a)(°C/W)
250
200
150
100
50
S(cm²)
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
Fig. 6: Reverse leakage current versus junction tempera-
ture (typical values).
IR(nA)
1.E+02
V_R=V_RM
1.E+01
1.E+00
1.E-01
1.E-02
0
Tj(°C)
25
50
75
100
125
150
Fig. 7: Clamping voltage versus peak pulse current (maxi-
mum values).
IPP(A)
100.0
10.0
10/1000µs
8/20µs
T_j initial =25°C
1.0
SM2T6V8A
SM2T14A
0.1
0
SM2T18A
SM2T27A
VCL(V)
5
10
15
20
25
30
35
40
45
Fig. 8: Junction capacitance versus reverse voltage ap-
plied (typical values).
C(pF)
10000
1000
100
F=1MHz
Vosc=30mVRMS
Tj=25°C
SM2T6V8A
SM2T14A
SM2T18A
SM2T27A
10
1
VR(V)
10
100
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