VN5E025AJTR-E Datasheet, PDF (29/37 Pages) STMicroelectronics – Single channel high-side driver with analog current sense for automotive applications

VN5E025AJ-E
Package and PC board thermal data
4
Package and PC board thermal data
4.1
PowerSSO-12 thermal data
Figure 35. PowerSSO-12 PC board
Note:
Layout condition of R_th and Z_th measurements (PCB: Double layer, Thermal Vias, FR4
area= 77mm x 86mm, PCB thickness=1.6mm, Cu thickness=70µm (front and back side),
Copper areas: from minimum pad lay-out to 8cm²).
Figure 36. R_thj-amb vs PCB copper area in open box free air condition
RTHj_amb( ° C/ W)
65
60
55
50
45
40
35
30
0
2
4
6
8
10
PCB Cu heat sink area ( cm^ 2)
Doc ID 13106 Rev 4
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