TDA7575B Datasheet, PDF (29/32 Pages) STMicroelectronics – 2 x 75W multifunction dual-bridge power amplifier with integrated digital diagnostics

TDA7575B
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Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 39. PowerSO36 (slug up) mechanical data and package dimensions
mm
inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 3.25
3.43 0.128
0.135
A2 3.1
3.2 0.122
0.126
A4 0.8
1 0.031
0.039
A5
0.2
0.008
a1 0.030
-0.040 0.0011
-0.0015
b 0.22
0.38 0.008
0.015
c 0.23
0.32 0.009
0.012
D 15.8
16 0.622
0.630
D1 9.4
9.8 0.37
0.38
D2
1
0.039
E 13.9
14.5 0.547
0.57
E1 10.9
11.1 0.429
0.437
E2
2.9
0.114
E3 5.8
6.2 0.228
0.244
E4 2.9
3.2 0.114
1.259
e
0.65
0.026
e3
11.05
0.435
G
0
0.075 0
0.003
H 15.5
15.9 0.61
0.625
h
1.1
0.043
L
0.8
1.1 0.031
0.043
N
10˚
10˚
s
8˚
8˚
(1) “D and E1” do not include mold flash or protusions.
Mold flash or protusions shall not exceed 0.15mm (0.006”)
(2) No intrusion allowed inwards the leads.
OUTLINE AND
MECHANICAL DATA
PowerSO36 (SLUG UP)
7183931 D
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