TDA749313TR Datasheet, PDF (28/30 Pages) STMicroelectronics – 3-watt 3-watt dual BTL class-D audio amplifier

Heatsink provision
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Heatsink provision
TDA7493
With the exposed-pad packages, it is possible to use the printed circuit board as a heatsink.
Using a PCB copper ground area of 3 x 3 cm² with 16 via holes to make contact with the
exposed pad, a thermal resistance of 37 °C/W can be achieved.
The amount of power dissipated within the device depends primarily on the supply voltage,
load impedance and output modulation level. The maximum estimated power dissipation for
the TDA7493 is around 1.1 W.
With the suggested copper area of 9 cm², a maximum junction temperature increase of less
than 40 °C above ambient can be expected, thus giving a maximum junction temperature,
Tj, of approximately 90 °C in consumer environments where 50 °C is specified as the
maximum ambient temperature. This provides a comfortable safety margin to the thermal
protection threshold at Tj = 150 °C.
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Doc ID 14570 Rev 6