TS2007_11 Datasheet, PDF (27/29 Pages) STMicroelectronics – 3 W filter-free Class D audio power amplifer with 6-12 dB fixed gain select

TS2007
Figure 55. DFN8 package mechanical data
Dimensions
Ref
Millimeters
Min
Typ
Max
Min
A
0.50
0.60
0.65
19.6
A1
0.02
0.05
A3
0.22
b
0.25
0.30
0.35
9.8
D
2.85
3.00
3.15
112.2
D2
1.60
1.70
1.80
63
E
2.85
3.00
3.15
112.2
E2
1.10
1.20
1.30
43.3
e
0.65
L⁽¹⁾
0.50
0.55
0.60
19.6
ddd
0.08
SEATING
PLANE
C
Package information
Mils
Typ
Max
23.6
25.6
0.8
1.9
8.6
11.8
13.8
118.1
124
66.9
70.8
118.1
124
47.2
51.2
25.5
21.6
23.6
3.1
D
e
12
34
Note:
8765
b
D2
1. The dimension of L is not compliant with JEDEC MO-248 which recommends 0.40 mm +/-0.10 mm.
The DFN8 package has an exposed pad E2 x D2. For enhanced thermal performance, the
exposed pad must be soldered to a copper area on the PCB, acting as a heatsink. This
copper area can be electrically connected to pin 7 or left floating.
Doc ID 13123 Rev 4
27/29