TDA7418 Datasheet, PDF (27/29 Pages) STMicroelectronics – 3 Band car audio procesor

TDA7418
6
Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK^®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 19. SO20 mechanical data and package dimensions
DIM.
MIN.
mm
TYP. MAX. MIN.
inch
TYP. MAX.
A 2.35
2.65 0.093
0.104
A1 0.10
0.30 0.004
0.012
B 0.33
0.51 0.013
0.200
C 0.23
0.32 0.009
0.013
D ^{(1) 12.60}
13.00 0.496
0.512
E 7.40
7.60 0.291
0.299
e
1.27
0.050
H 10.0
10.65 0.394
0.419
h 0.25
0.75 0.010
0.030
L 0.40
1.27 0.016
0.050
k
0˚ (min.), 8˚ (max.)
ddd
0.10
0.004
(1) “D” dimension does not include mold flash, protusions or gate
burrs. Mold flash, protusions or gate burrs shall not exceed
0.15mm per side.
OUTLINE AND
MECHANICAL DATA
SO20
0016022 D
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