VN5E025MJ-E Datasheet, PDF (26/34 Pages) STMicroelectronics – Single channel high side driver with analog current sense for automotive applications

Package and PC board thermal data
4
Package and PC board thermal data
4.1
PowerSSO-12 thermal data
Figure 32. PowerSSO-12 PC board
VN5E025MJ-E
Note:
Layout condition of R_th and Z_th measurements (PCB: Double layer, Thermal Vias,
FR4 area = 77 mm x 86 mm, PCB thickness = 1.6 mm, Cu thickness = 70 µm (front and
back side), Copper areas: from minimum pad lay-out to 8cm²).
Figure 33. R_thj-amb vs PCB copper area in open box free air condition
RTHj_amb( °C/ W)
65
60
55
50
45
40
35
30
0
2
4
6
8
10
PCB Cu heat sink area ( cm^ 2)
26/35
DocID16373 Rev 2