VN5050AJ-E Datasheet, PDF (25/32 Pages) STMicroelectronics – Single channel high side driver with analog current sense for automotive applications

VN5050AJ-E
Package and PCB thermal data
4
Package and PCB thermal data
4.1
PowerSSO-12 thermal data
Figure 28. PowerSSO-12 PC Board
Note:
Layout condition of R_th and Z_th measurements (PCB: Double layer, Thermal Vias, FR4
area= 77mm x 86mm,PCB thickness=1.6mm, Cu thickness=70 µm (front and back side),
Copper areas: from minimum pad lay-out to 8cm²).
Figure 29. R_thj-amb Vs. PCB copper area in open box free air condition
RTHj_amb(°C /W)
70
65
60
55
50
45
40
0
2
4
6
8
10
PCB Cu heatsink area (cm^2)
25/32