STA5620 Datasheet, PDF (25/29 Pages) STMicroelectronics – Fully integrated RF front-end for GPS

STA5620
9
Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK^®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 6. VFQFPN 32L (5x5x1.0mm) mechanical data and package dimensions
DIM.
MIN.
mm
TYP. MAX. MIN.
inch
TYP. MAX.
A 0.800 0.900 1.000 0.031 0.035 0.039
A 0.800 0.900 1.000 0.0315 0.0354 0.0394
A1
0.020 0.050
0.0008 0.0020
A3
0.200
0.0079
b 0.180 0.250 0.300 0.0071 0.0098 0.0118
D 4.850 5.000 5.150 0.1909 0.1969 0.2028
D2 3.500 3.600 3.700 0.1378 0.1417 0.1457
E 4.850 5.000 5.150 0.1909 0.1969 0.2028
E2 3.500 3.600 3.700 0.1378 0.1417 0.1457
e
0.500
0.0197
L 0.300 0.400 0.500 0.0118 0.0157 0.0197
ddd
0.050
0.0020
OUTLINE AND
MECHANICAL DATA
VFQFPN32 (5x5x1.0mm)
Very Fine Quad Flat Package No lead
7376875 F
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