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| TS4855 Datasheet, PDF (24/27 Pages) STMicroelectronics – LOUDSPEAKER & HEADSET DRIVER WITH VOLUME CONTROL | |||
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TS4855
7 PACKAGE INFORMATION
Flip-chip packageâ18 bumps: TS4855IJT
Package Information
Marking (on top view)
s ST LOGO
s Part number: A55
s Three digit Datecode: YWW
s The dot is for marking the bump1A
Package mechanical data
2440µm
750µm
500µm
866µm
866µm
2170µm
u Die size: 2440µm x 2170µm ±30µm
u
u
Die height (including bumps): 600µm ±30µm
Bumps diameter: 300µm ±15µm
u Bumps height: 250µm ±15µm
u Pitch: 500µm ±10µm
600µm
24/27
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