ST7570TR Datasheet, PDF (23/26 Pages) STMicroelectronics – S-FSK power line networking system-on-chip

ST7570
10 Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
The ST7570 is hosted in a 48 pin thermally enhanced very thin fine pitch quad flat package
no lead (VFQFPN) with exposed pad, which allows the device dissipating the heat that is
generated by the operation of the two linear regulators and the power amplifier.
A mechanical drawing of the VFQFPN48 package is included in Figure 15.
Table 9. VFQFPN48 (7 x 7 x 1.0 mm) package mechanical data
Dim.
Min.
(mm)
Typ.
A
0.80
0.90
A1
0.02
A2
0.65
A3
0.25
b
0.18
0.23
D
6.85
7.00
D2
4.95
5.10
E
6.85
7.00
E2
4.95
5.10
e
0.45
0.50
L
0.30
0.40
ddd
0.08
Max.
1.00
0.05
1.00
0.30
7.15
5.25
7.15
5.25
0.55
0.50
Doc ID 17526 Rev 2
23/26