ST7FOXF1 Datasheet, PDF (220/226 Pages) STMicroelectronics – 8-bit MCU with single voltage Flash memory, SPI, I²C, ADC, timers

Package mechanical data
14 Package mechanical data
ST7FOXF1, ST7FOXK1, ST7FOXK2
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 94. 20-pin plastic small outline package, 300-mil width, package outline
D
B
A
A1
e
L
a
h x 45×
c
EH
Table 97.
Dim.
20-pin plastic small outline package, 300-mil width, mechanical data
mm
inches⁽¹⁾
Min
Typ
Max
Min
Typ
Max
A
2.35
2.65
0.0925
0.1043
A1
0.10
0.30
0.0039
0.0118
B
0.33
0.51
0.0130
0.0201
C
0.23
0.32
0.0091
0.0126
D
12.60
13.00
0.4961
0.5118
E
7.40
7.60
0.2913
0.2992
e
1.27
0.0500
H
10.00
10.65
0.3937
0.4193
h
0.25
0.75
0.0098
0.0295
α
0°
8°
0°
8°
L
0.40
1.27
0.0157
0.0500
Number of Pins
N
20
1. Values in inches are converted from mm and rounded to 4 decimal digits.
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