STM32F427XX Datasheet, PDF (218/239 Pages) STMicroelectronics – ARM Cortex-M4 32b MCU+FPU, 225DMIPS, up to 2MB Flash/256+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 comm. interfaces, camera & LCD-TFT

STM32F427xx STM32F429xx
Package information
Table 116. UFBGA169 - 169-ball 7 x 7 mm 0.50 mm pitch, ultra fine pitch ball grid array
package mechanical data (continued)
Symbol
millimeters
Min
Typ
Max
inches⁽¹⁾
Min
Typ
Max
F
0.450
0.500
0.550
0.0177
0.0197
0.0217
ddd
-
-
0.100
-
-
0.0039
eee
-
-
0.150
-
-
0.0059
fff
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 96. UFBGA169 - 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch
ball grid array recommended footprint
Note:
'SDG
'VP
069
Table 117. UFBGA169 recommended PCB design rules (0.5 mm pitch BGA)
Dimension
Recommended values
Pitch
Dpad
0.5
0.27 mm
Dsm
Solder paste
0.35 mm typ. (depends on the soldermask
registration tolerance)
0.27 mm aperture diameter.
Non-solder mask defined (NSMD) pads are recommended.
4 to 6 mils solder paste screen printing process.
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