STBR606 Datasheet, PDF (2/4 Pages) STMicroelectronics – 50-60Hz RECTIFICATION BRIDGE

STBR606/608
THERMAL PARAMETERS
Symbol
R_th(j-c)
R_th(j-a)
Junction to case
Junction to ambient
Parameter
Min.
Typ.
7.4
Max.
8
35
Unit
°C/W
°C/W
ELECTRICAL CHARACTERISTICS
Symbol
V_F
I_R
C
Parameter
Test conditions
Forward voltage drop
I_F = 6A
Reverse leakage current per V_R = V_RRM
leg
Tj = 25°C
Tj = 125°C
Junction capacitance per leg (note 1)
Note 1: Measured at 1MHz and applied reverse voltage of 4V.
Min.
Typ. Max. Unit
1.05 V
5
µA
50 µA
55
pF
Fig. 1: Average power dissipation of bridge versus
average output current.
PF(av)(W)
12
11
10
9
8
7
6
5
4
3
2
1
0
0.0 0.5 1.0
IP / IF(av)=20
IP / IF(av)=10
IF(av)(A)
1.5 2.0 2.5 3.0 3.5
IP / IF(av)=5
(capacitive load)
IP / IF(av)=P
(resistive load)
4.0 4.5 5.0 5.5 6.0
Fig. 2: Average output current versus ambient
temperature (resistive load or inductive load)
IF(av)(A)
7
6
Rth(j-a)=Rth(j-c)
5
Rth(j-a)=15°C/W
4
3
Rth(j-a)=35°C/W
2
1
Tamb(°C)
0
0
25
50
75
100
125
150
Fig. 3: Variation of thermal impedance junction to
ambient versus pulse duration (printed circuit
board epoxy FR4)
Zth(j-a)(°C/W)
100.0
Free air
10.0
1.0
0.1
1.E-02
1.E-01
tp(s)
1.E+00
1.E+01
1.E+02
1.E+03
Fig. 4: Forward voltage drop versus forward
current (typical values, per leg).
IFM(A)
1000.0
100.0
10.0
1.0
Tj=125°C
Tj=25°C
VFM(V)
0.1
0.0
0.5
1.0
1.5
2.0
2.5
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