STBR406 Datasheet, PDF (2/4 Pages) STMicroelectronics – 50-60Hz RECTIFICATION BRIDGE

STBR406/408
THERMAL PARAMETERS
Symbol
R_th(j-c)
R_th(j-a)
Junction to case
Junction to ambient
Parameter
Min.
Typ.
7.6
Max.
8.4
35
Unit
°C/W
°C/W
ELECTRICAL CHARACTERISTICS
Symbol
V_F
I_R
C
Parameter
Forward voltage drop
Reverse leakage current per
leg
Junction capacitance per leg
Test conditions
I_F = 4A
V_R = V_RRM Tj = 25°C
Tj =125°C
(note 1)
Min.
Typ.
40
Max.
1.05
5
50
Note 1: Measured at 1MHz and applied reverse voltage of 4V.
Unit
V
µA
µA
pF
Fig. 1: Average power dissipation of bridge versus
average output current.
PF(av)(W)
8
7
6
5
4
3
2
1
0
0.0
0.5
IP / IF(av)=20
IP / IF(av)=10
IP / IF(av)=5
(capacitive load)
IP / IF(av)=P
(resistive load)
IF(av)(A)
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Fig. 2: Average output current versus ambient
temperature (resistive load or inductive load)
IF(av)(A)
5
Rth(j-a)=Rth(j-c)
4
3
Rth(j-a)=15°C/W
2
Rth(j-a)=35°C/W
1
Tamb(°C)
0
0
25
50
75
100
125
150
Fig. 3: Variation of thermal impedance junction to
ambient versus pulse duration (printed circuit
board epoxy FR4).
Zth(j-a)(°C/W)
100.0
Free air
10.0
1.0
0.1
1.E-02
1.E-01
tp(s)
1.E+00
1.E+01
1.E+02
1.E+03
Fig. 4: Forward voltage drop versus forward
current (typical values, per leg).
IFM(A)
1000.0
100.0
10.0
1.0
Tj=125°C
Tj=25°C
VFM(V)
0.1
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
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