VN750-E Datasheet, PDF (18/31 Pages) STMicroelectronics – HIGH SIDE DRIVER

VN750-E / VN750S-E / VN750PT-E / VN750B5-E
PPAK Thermal Data
Figure 33. PPAK PC Board
Layout condition of R_th and Z_th measurements (PCB FR4 area= 60mm x 60mm, PCB thickness=2mm,
Cu thickness=35µm, Copper areas: 0.44cm², 8cm²).
Figure 34. R_thj-amb Vs PCB copper area in open box free air condition
RTHj_amb (ºC/W)
90
80
70
60
50
40
30
20
10
0
0
2
4
6
8
10
PCB Cu heatsink area (cm^2)
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