UM1547 Datasheet, PDF (18/51 Pages) STMicroelectronics – Using the firmware of the AT command set

AT command list
UM1547
3.15.2
The discovery COD optional parameters are listed here below:
– miscellaneous
– computer
– phone
– lan
– peripheral
– imaging
– wearable
– toy
– health
Responses
When the discovery command has been accepted, the response is:
AT-AB InqPending
Once the initial inquiry is complete and discovery has been started, the response is:
AT-AB DiscoveryPending [num]
where [num] is the number of devices found, in decimal (up to 10 will be reported).
For each name request that is successful, the response uses the returned names in the
following format.
AT-AB Device [BD addr] [name]
where [BD addr] is in hexadecimal with the most significant byte first. [name] is a string in
double quotes " ".
For each unsuccessful name request, the corresponding name is replaced by “Unknown”.
The name request may not be successful if unable to make a connection for the request.
AT-AB Device [BD addr] "Unknown"
3.16
EnableBond
The EnableBond command is used to enable bonding with another device. The BD address,
PIN and timeout parameters are optional.
When no BD address is specified, requests from all BD Addresses are allowed.
If a BD address is specified, bonding requests from devices with BD Addresses other than
the one specified will fail and the existing link key will be deleted for that device.
Optionally, a PIN code may be entered with this command. If no PIN code is specified, the
default PIN code will be used.
Also, a timeout value, in seconds, may be entered after the PIN code. Bonding will be
disabled automatically after the requested timeout. If no timeout is specified, bonding is
enabled until reset or until the DisableBond command is used.
If this command is issued multiple times, only the last PIN and BD address are saved. Also,
if this command is issued before the first timeout occurs, the subsequent command will
extend the timeout. The timeout is always set to the specified time beyond the last received
EnableBond.
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DocID023232 Rev 5