TDA7342_06 Datasheet, PDF (18/20 Pages) STMicroelectronics – Digitally controlled audio processor

Package information
5
Package information
TDA7342
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 7. LQFP32 Mechanical data & package dimensions
DIM.
MIN.
mm
TYP. MAX. MIN.
inch
TYP. MAX.
A
1.600
0.0630
A1 0.050
0.150 0.0020
0.0059
A2 1.350 1.400 1.450 0.0531 0.0551 0.0571
b 0.300 0.370 0.450 0.0118 0.0146 0.0177
c 0.090
0.200 0.0035
0.0079
D 8.800 9.000 9.200 0.3465 0.3543 0.3622
D1 6.800 7.000 7.200 0.2677 0.2756 0.2835
D3
5.600
0.2205
E 8.800 9.000 9.200 0.3465 0.3543 0.3622
E1 6.800 7.000 7.200 0.2677 0.2756 0.2835
E3
5.600
0.2205
e
0.800
0.0315
L 0.450 0.600 0.750 0.0177 0.0236 0.0295
L1
1.000
0.0394
K
3.500 7.000
0.1378 0.2756
ccc
0.100
0.0039
OUTLINE AND
MECHANICAL DATA
Weight: 0.20gr
LQFP32 (7 x 7 x 1.40mm)
18/20
0060661 D