VNI4140K-32 Datasheet, PDF (15/26 Pages) STMicroelectronics – Quad high side smart power solid state relay

VNI4140K-32
Package and PCB thermal data
9
Package and PCB thermal data
9.1
VNI4140K-32 thermal data
Figure 10. VNI4140K-32 PCB
Note:
Layout condition of R_th and Z_th measurements (PCB: Double layer, Thermal Vias,
FR4 area = 77 mm x 86 mm, PCB thickness=1.6 mm, Cu thickness = 70 mm (front and back
side), Copper areas: from minimum pad layout to 8 cm²).
Figure 11. R_thJA vs. PCB copper area in open box free air condition (one channel ON)
Doc ID022576 Rev 3
15/26