TS556_08 Datasheet, PDF (15/19 Pages) STMicroelectronics – Low-power dual CMOS timer

TS556
5.1
DIP14 package information
Figure 8. DIP14 package mechanical drawing
Package information
Note:
Table 11. DIP14 package mechanical data
Dimensions
Millimeters
Inches
Ref.
Min.
Typ.
Max.
Min.
Typ.
Max.
A
5.33
0.21
A1
0.38
0.015
A2
2.92
3.30
4.95
0.11
0.13
0.19
b
0.36
0.46
0.56
0.014
0.018
0.022
b2
1.14
1.52
1.78
0.04
0.06
0.07
c
0.20
0.25
0.36
0.007
0.009
0.01
D
18.67
19.05
19.69
0.73
0.75
0.77
E
7.62
7.87
8.26
0.30
0.31
0.32
E1
6.10
6.35
7.11
0.24
0.25
0.28
e
2.54
0.10
e1
15.24
0.60
eA
7.62
0.30
eB
10.92
0.43
L
2.92
3.30
3.81
0.11
0.13
0.15
D and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed 0.25 mm.
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