E-L9637D Datasheet, PDF (13/15 Pages) STMicroelectronics – Monolithic bus driver with ISO 9141 interface

L9637
4
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
Figure 10. SO8 mechanical data and package dimensions
mm
inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A
1.750
0.0689
A1 0.100
0.250 0.0039
0.0098
A2 1.250
0.0492
b 0.280
0.480 0.0110
0.0189
c 0.170
0.230 0.0067
0.0091
D ^{(1) 4.800 4.900 5.000 0.1890 0.1929 0.1969}
E 5.800 6.000 6.200 0.2283 0.2362 0.2441
E1^{(2) 3.800 3.900 4.000 0.1496 0.1535 0.1575}
e
1.270
0.0500
h 0.250
0.500 0.0098
0.0197
L 0.400
1.270 0.0157
0.0500
L1
1.040
0.0409
k
0˚
8˚
0˚
8˚
ccc
0.100
0.0039
Notes: 1. Dimensions D does not include mold flash,
protrusions or gate burrs.
Mold flash, potrusions or gate burrs shall not
exceed 0.15mm in total (both side).
2. Dimension “E1” does not include interlead flash
or protrusions. Interlead flash or protrusions shall
not exceed 0.25mm per side.
OUTLINE AND
MECHANICAL DATA
SO-8
Doc ID 1765 Rev 7
0016023 D
13/15