English
Language : 

STM32F378XX Datasheet, PDF (129/131 Pages) STMicroelectronics – Reset and power management
STM32F378xx
9
Revision history
Revision history
Date
04-Mar-2014
09-Apr-2014
21-Jul-2015
Table 80. Document revision history
Revision
Changes
1
Initial release.
2
Removed sub-set part number (64KB and 128KB).
Updated Part numbering on page 128
Updated Section 7
Updated Section 3.13
Updated Section 3.7.1, Section 3.7.3
Updated Table 2: Device overview, Table 11: STM32F378xx pin
definitions, Table 22: General operating conditions, Table 47: ESD
absolute maximum ratings, Table 70: SDADC characteristics,
Table 74: WLCSP66 - 66-pin, 3.767 x 4.229 mm, 0.4 mm pitch
wafer level chip scale package mechanical data and Table 75:
LQPF100 - 100-pin, 14 x 14 mm low-profile quad flat package
mechanical data, Table 78: Package thermal characteristics and
Table 79: Ordering information scheme
Updated Figure 5: STM32F378xx UFBGA100 ballout, Figure 10:
Power supply scheme, Figure 35: WLCSP66 - 66-pin, 3.767 x
4.229 mm, 0.4 mm pitch wafer level chip scale package outline,
Figure 36: WLCSP66 marking example (package top view),
3
Figure 38: LQFP100 - 100-pin, 14 x 14 mm low-profile quad flat
recommended footprint, Figure 39: LQFP100 marking example
(package top view), Figure 40: LQFP64 - 64-pin, 10 x 10 mm low-
profile quad flat package outline, Figure 41: LQFP64 - 64-pin, 10 x
10 mm low-profile quad flat package recommended footprint,
Figure 42: LQFP64 marking example (package top view),
Figure 44: LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat
package recommended footprint, Figure 45: LQFP48 marking
example (package top view).
Added Table 30: Typical and maximum current consumption from
VBAT supply, Table 63: Comparator characteristics, Table 73:
UFBGA100 recommended PCB design rules (0.5 mm pitch BGA)
Added Figure 12: Typical VBAT current consumption (LSE and
RTC ON/LSEDRV[1:0]='00'), Figure 31: Maximum VREFINT
scaler startup time from power down and Figure 33: UFBGA100 -
100-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array
package recommended footprint.
DocID025608 Rev 4
129/131
130