STM32L15XQC Datasheet, PDF (127/134 Pages) STMicroelectronics – Ultra-low-power platform

STM32L151xC/C-A STM32L152xC/C-A
Package information
Table 69. WLCSP64, 0.4 mm pitch wafer level chip scale package mechanical data
(continued)
Symbol
millimeters
Min
Typ
Max
inches⁽¹⁾
Min
Typ
Max
b⁽²⁾
0.240
0.270
0.300
0.0094
0.0106
0.0118
D
4.504
4.539
4.574
0.1773
0.1787
0.1801
E
4.876
4.911
4.946
0.1920
0.1933
0.1947
e
-
0.400
-
-
0.0157
-
e1
-
2.800
-
-
0.1102
-
F
-
0.870
-
-
0.0343
-
G
-
1.056
-
-
0.0416
-
aaa
-
-
0.100
-
-
0.0039
bbb
-
-
0.100
-
-
0.0039
ccc
-
-
0.100
-
-
0.0039
ddd
-
-
0.050
-
-
0.0020
eee
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Figure 44. WLCSP64, 0.4 mm pitch wafer level chip scale package
recommended footprint
'SDG
'VP
069
Table 70. WLCSP64, 0.4 mm pitch package recommended PCB design rules
Dimension
Recommended values
Pitch
0.4
Dpad
260 µm max. (circular)
220 µm recommended
Dsm
300 µm min. (for 260 µm diameter pad)
PCB pad design
Non-solder mask defined via underbump allowed.
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