STM8L151C8T6 Datasheet, PDF (120/129 Pages) STMicroelectronics – 8-bit ultralow power MCU, up to 64 KB Flash + 2 KB data EEPROM, RTC, LCD, timers, USARTs, I2C, SPIs, ADC, DAC, comparators

Electrical parameters
STM8L15xx8, STM8L15xR6
9.4
Thermal characteristics
The maximum chip junction temperature (T_Jmax) must never exceed the values given in
Table 18: General operating conditions on page 68.
The maximum chip-junction temperature, T_Jmax, in degree Celsius, may be calculated using
the following equation:
T_Jmax = T_Amax + (P_Dmax x Θ_JA)
Where:
● T_Amax is the maximum ambient temperature in ° C
● Θ_JA is the package junction-to-ambient thermal resistance in ° C/W
● P_Dmax is the sum of P_INTmax and P_I/Omax (P_Dmax = P_INTmax + P_I/Omax)
● P_INTmax is the product of I_DD and V_DD, expressed in Watts. This is the maximum chip
internal power.
● P_I/Omax represents the maximum power dissipation on output pins
Where:
P_I/Omax = Σ (V_OL*I_OL) + Σ((V_DD-V_OH)*I _OH),
taking into account the actual V_OL/I_OL and V_OH/I_OH of the I/Os at low and high level in
the application.
Table 62. Thermal characteristics⁽¹⁾
Symbol
Parameter
Value
Unit
Θ_JA
Thermal resistance junction-ambient
LQFP 48- 7 x 7 mm
65
Θ_JA
Thermal resistance junction-ambient
UFQFPN 48- 7 x 7mm
32
Θ_JA
Thermal resistance junction-ambient
LQFP 64- 10 x 10 mm
48
Θ_JA
Thermal resistance junction-ambient
LQFP 80- 14 x 14 mm
38
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
environment.
°C/W
°C/W
°C/W
°C/W
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Doc ID 17943 Rev 5