TDA7266SAN Datasheet, PDF (12/15 Pages) STMicroelectronics – 5 W + 5 W dual bridge amplifier

Package mechanical data
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Package mechanical data
TDA7266SAN
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
Clipwatt assembly suggestions
The recommended mounting method of the Clipwatt on an external heatsink requires the
use of a clip placed as close as possible to the center of the plastic body, as indicated in the
example of Figure 15.
A thermal grease can be used in order to reduce the additional thermal resistance of the
contact between the package and heatsink.
A force of 7 - 10 kg gives a good contact and the clip must be designed in order to withstand
a maximum contact pressure of 15 kg/mm² between itself and the plastic body case.
For example, if a 15 kg force is applied by the clip on the package, the clip must have a
contact area of at least 1 mm².
Figure 15. Example of right placement of the clip
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Doc ID 023621 Rev 1