LM358W Datasheet, PDF (12/16 Pages) STMicroelectronics – Low Power Dual Operational Amplifiers

Package Mechanical Data
5 Package Mechanical Data
LM358W-LM358AW
In order to meet environmental requirements, ST offers these devices in ECOPACK^® packages.
These packages have a Lead-free second level interconnect. The category of second level
interconnect is marked on the package and on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:
www.st.com..
5.1 DIP8 Package
DIM.
A
a1
B
B1
b
b1
D
E
e
e3
e4
F
I
L
Z
Plastic DIP-8 MECHANICAL DATA
MIN.
0.7
1.39
0.91
0.38
0.44
mm.
TYP
3.3
0.5
8.8
2.54
7.62
7.62
3.3
MAX.
1.65
1.04
0.5
9.8
7.1
4.8
1.6
MIN.
0.028
0.055
0.036
0.015
0.017
inch
TYP.
0.130
0.020
0.346
0.100
0.300
0.300
0.130
MAX.
0.065
0.041
0.020
0.386
0.280
0.189
0.063
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P001F