M24LR64-R_1006 Datasheet, PDF (119/128 Pages) STMicroelectronics – 64 Kbit EEPROM with password protection & dual interface

M24LR64-R
Package mechanical data
Figure 75. UFDFPN8 (MLP8) – Ultra thin fine pitch dual flat package no lead
2 x 3 mm, package outline
D
e
b
L3
L1
E
E2
A
A1
L
D2
ddd
UFDFPN-01
1. Drawing is not to scale.
Table 109. UFDFPN8 (MLP8) – Ultra thin fine pitch dual flat package no lead
2 x 3 mm, package mechanical data
Symbol
millimeters
Typ
Min
Max
inches⁽¹⁾
Typ
Min
Max
A
0.55
0.45
0.6
0.0217
0.0177
0.0236
A1
0.02
0
0.05
0.0008
0
0.002
b
0.25
0.2
0.3
0.0098
0.0079
0.0118
D
2
1.9
2.1
0.0787
0.0748
0.0827
D2
1.6
1.5
1.7
0.063
0.0591
0.0669
E
3
2.9
3.1
0.1181
0.1142
0.122
E2
0.2
0.1
0.3
0.0079
0.0039
0.0118
e
0.5
-
-
0.0197
-
-
L
0.45
0.4
0.5
0.0177
0.0157
0.0197
L1
0.15
0.0059
L3
ddd⁽²⁾
0.3
0.08
0.0118
0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
Doc ID 15170 Rev 10
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